ASML Unveils EUV Light Source Advance That Could Yield 50% More Chips By 2030

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by BeauHD

February 24, 2026

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ASML, the world’s sole manufacturer of commercial extreme ultraviolet lithography (EUV) machines, has unveiled a groundbreaking advancement in its EUV light source technology. By increasing the power of its EUV light source from 600 watts to 1,000 watts, the company aims to boost chip production capacity by up to 50% by the end of the decade. This innovation is crucial for ASML as it seeks to maintain its competitive edge against emerging rivals in the U.S. and China. The improved light source enables faster chip manufacturing, reducing costs per chip while increasing output. For instance, chip factories will be able to process up to 330 silicon wafers per hour by 2030, compared to the current rate of 220. This advancement directly addresses the growing demand for advanced computing chips from leading manufacturers like TSMC and Intel. The key to this breakthrough lies in ASML’s ability to double the number of tin droplets used in its machines—from approximately 50,000 to 100,000 per second—and shape them into plasma using two smaller laser bursts instead of one. This process generates EUV light with a wavelength of 13.5 nanometers, which is critical for producing cutting-edge chips. The increased power and efficiency of the EUV source will allow chipmakers to significantly reduce exposure times during the manufacturing process. ASML’s executive vice president, Teun van Gogh, emphasized that this innovation ensures customers can continue using EUV technology at a much lower cost, making it more accessible for high-volume chip production. This development is particularly significant in the context of the global chip shortage and the ongoing competition to advance semiconductor manufacturing. ASML’s leadership in EUV technology positions it as a key player in enabling faster and more efficient chip production. The company’s researchers are already

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Originally published on Slashdot on 2/24/2026